Particle counts at 20 nm
Yield-limiting particles are far below the detection threshold of conventional instrumentation, let alone conventional filtration.
Advanced Manufacturing · Industry
Ultra-high-purity filtration for wet process, gas delivery and sub-fab abatement in advanced fabs.
- Rated particle removal
- 20 nm
- Metallic extractables level
- ppt
- Cleanroom class supported
- ISO 3
The constraint
Contamination control at the node.
At advanced process nodes, a single particle in the wrong place destroys a die. Filtration is not a utility here — it is a direct determinant of yield and therefore of the fab's economics.
Standards we work to
- SEMI F57
- SEMI C79
- ISO 14644
- ASTM D5127
- IEST-RP-CC021
Metallic ion contribution
Filter materials must contribute no measurable metallic ions to process chemistry at parts-per-trillion sensitivity.
Chemical compatibility breadth
Fabs run dozens of aggressive chemistries requiring an all-fluoropolymer flow path throughout.
Change-out contamination risk
The change-out procedure itself is a contamination event and must be engineered as carefully as the filter.
Applications
Where we filter in semiconductor
- 01CMP slurry filtration and point-of-use polishing
- 02Photoresist and developer dispense filtration
- 03Ultrapure water distribution polishing
- 04Bulk and specialty gas delivery filtration
- 05Sub-fab scrubber and abatement filtration
- 06Make-up air and cleanroom recirculation
Recommended platforms
What we typically specify here
Next step
Send us your semiconductor stream data.
Our applications engineers work to the standards listed above every week. You will not be explaining your industry from first principles.
Or call +91 79 4890 2200 · sales@worldasatech.com